Difference between revisions of "Team:Czech Republic/Protocols"
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= Soft lithography - Bonding PDMS-Glass = | = Soft lithography - Bonding PDMS-Glass = | ||
| + | |||
| + | == Preparation of the substrates == | ||
| + | |||
| + | === Glass slide === | ||
*2.5 minutes air plasma treatment | *2.5 minutes air plasma treatment | ||
*post-bake 80°C/1h | *post-bake 80°C/1h | ||
| + | |||
| + | === PDMS === | ||
| + | |||
| + | *Cut the PDMS | ||
| + | |||
| + | == Air plasma treatment == | ||
| + | |||
| + | *Position the substrate | ||
| + | |||
| + | == Alignment and permanent bonding == | ||
| + | |||
| + | *Place PDMS over glass slide | ||
= ... = | = ... = | ||
{{:Team:Czech_Republic/Template:Bottom}} | {{:Team:Czech_Republic/Template:Bottom}} | ||
Revision as of 11:50, 14 September 2015
Protocols
Contents
Purification
....
Restriction
...
GA
...
Soft lithography - PDMS molding
- Silicon masters
- 40g PDMS + 4g curing agent
- curing 80°C/2h
Soft lithography - Bonding PDMS-Glass
Preparation of the substrates
Glass slide
- 2.5 minutes air plasma treatment
- post-bake 80°C/1h
PDMS
- Cut the PDMS
Air plasma treatment
- Position the substrate
Alignment and permanent bonding
- Place PDMS over glass slide
...