Team:Sherbrooke/Experiments

Hardware Experiments & Protocols

Projects modules

 

MC1.5

Thermal and magnetisation experimentations have been conduct to validate the design of the MC1.5 module.

 

Thermal experimentation

Simulation

Thermal simulations have been done on the software COMSOL. These simulations have been used to verify the heat transfer of the aluminium mold of the modules, thus helping us improving their design. For the MC1.5, many simulations have been done on different designs. These are the simulation parameters for the latest design.

Simulation parameters
Parameters Values
Peltier element cooling power 30W
Peltier element heating power 140W
Air convective heat transfer coefficient 50W/(m2 ℃)
Isolation conductive heat transfer coefficient 5W/(m ℃)
Aluminium type 6061-t6
Aluminium conductive heat transfer coefficient 167W/(m ℃)
Aluminium specific heat capacity 0.896J/(g ℃)
See Results
Back to MC1.5

Trials protocols

These are the protocol used to test the thermal characteristics of the MC1.5 prototype. These protocols have been tested on a single sub-module of a MC1.5 .


MC1.5 Thermal Experimentations Setup

 

Thermal Experimentations Protocols

 
Maintaining a temperature below room temperature test
Purpose

Determine if the module temperature stability fits the specified of ±1.5℃, when the set temperature is below room temperature. Also, this test determines the voltage versus the set temperature relation.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier gnd and PS gnd to Peltier vcc)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
  5. Wait for the thermometer measure to stabilize for 20 seconds
Measurement
  1. Set the voltage of the high current power supply to 1V
  2. Wait for thermometer measure to stabilize for at least 20 seconds
  3. Note the thermometer measure and the voltage associated with it
  4. Repeats set 1, 2 and 3 and increased the voltage by 1V each time until the thermometer measure is below the specified lower limit (0℃)
  5. Stop the high current power supply
  6. Stop the fan power supply

See Results
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Maintaining a temperature over room temperature test
Purpose

Determine if the module temperature stability fits the specification of ±1.5℃, when the set temperature is over room temperature. Also, this test determines the voltage versus the set temperature relation.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier vcc and PS gnd to Peltier gnd)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
  5. Wait for the thermometer measure to stabilize for 20 seconds
Measurement
  1. Set the voltage of the high current power supply to 1V
  2. Wait for thermometer measure to stabilize for at least 20 seconds
  3. Note the thermometer measure and the voltage associated with it
  4. Repeats set 1, 2 and 3 and increased the voltage by 1V each time until the thermometer measure is over the specified upper limit (80℃)
  5. Stop the high current power supply
  6. Stop the fan power supply

See Results
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Cooling speed test
Purpose

Determine if the module cooling speed fits the specification of 0.5 to 1℃/s. Also, this test determines the optimal voltage to apply to cool the aluminium mold.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier vcc and PS gnd to Peltier gnd)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
Measurement
  1. Set the voltage of the high current power supply to reach 85℃
  2. Wait for thermometer measure to stabilize for at least 20 seconds
  3. Stop the high current power supply
  4. Invert connection between the Peltier element and the high current power supply
  5. Set the high current power supply to 15.5V (calculated by this method)
  6. Start the chronometer when the thermometer measure reach 80℃
  7. For each 10℃ temperature drop, note the timestamp until 4℃ is reached
  8. Stop the high current power supply
  9. Invert connection between the Peltier element and the high current power supply
  10. Repeats step 1 to 9 for cooling voltage of 15V and 16V

See Results
 
Theoretical method to determine the optimised cooling voltage

This method is an iterative method that is used to approximate the voltage to apply to the Peltier element to cool the aluminium mold.

Logically the more power applied to the Peltier element the more power is removes from the aluminium mold, thus increasing its cooling speed. However, the power to disperse by the heat sink is too high, so the hot side of the Peltier element is so hot that the temperature difference between the hot side and the cool side is not enough to reach 0℃.

The following figure, from the Peltier element datasheet, shows the relation between the power to dissipate by the heat sink versus the temperature difference between the hot side and cold side (ΔT).


Peltier element Waste Heat vs ΔT

On the following graph, a ΔT is set to 60℃ and the voltage to 24.4V, thus giving 190W to dissipate.

The following equation gives the hot side temperature giving these parameters:

th = tamb + Qh * Rheat sink

th = Hot side temperature (℃)
tamb = Ambient temperature (℃)
Qh = Power to dissipate (W)
Rheat sink = Thermal resistance of the heat sink (℃/W)

The heat sink thermal resistance have been tested and characterized at 0.22℃/W and the ambient temperature to 22℃, thus, giving a hot side temperature of 63.8℃. By subtracting the set ΔT to this result, a temperature of 3.8℃ is obtained on the cool side. This is over the specification of 0℃.

So, another iteration of the method with a lower voltage and ΔT is necessary.

After a couple of iterations, the voltage of 15.5V and the ΔT of 40℃ have given the specification of 0℃.


Back to MC1.5 Thermal Experimentations Protocols  
Heating speed test
Purpose

Determine if the module heating speed fits the specified 0.5 to 1℃/s.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier gnd and PS gnd to Peltier vcc)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
Measurement
  1. Set the voltage of the high current power supply to reach -1℃
  2. Wait for thermometer measure to stabilize for at least 20 second
  3. Stop the high current power supply
  4. Invert connection between the Peltier element and the high current power supply
  5. Set the high current power supply to 24V (Maximal voltage available for the Peltier element)
  6. Start the chronometer when the thermometer measure reach 4℃
  7. For each 10℃ temperature rise, note the timestamp until 80℃ is reached
  8. Stop the high current power supply

See Results
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Magnetisation experimentations

Trials Protocols

These are the protocols used to test the magnetisation characteristics of the MC1.5 prototype. These protocols have been tested on a single sub-module of a MC1.5.

Applying an electromagnetic field on the test tube liquid is one of the key functionality of the MC1.5. This experiment was conduct in order to confirm that the neodymium magnets are powerful enough.

Magnet attraction power test
Purpose

Determine if the neodymium magnets are powerful enough to attract the microscopic magnetic beads on the side of the test tube within 5 minutes.

Material Setup
  1. Agitate the 1.5ml test tube to ensure that the magnetic beads are spreads through the liquid
  2. Place the 1.5ml test tube at the end of the ruler
  3. Place the center of the magnet in the same relative position as in the MC1.5 module (5mm from the bottom of the test tube and 4mm from the side of the test tube)
Measurement
  1. As soon as the magnet is in position, start the chronometer
  2. Stop the chronometer when the liquid has the same transparency as distilled water
  3. Note the timestamp on the chronometer

See Results
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TAC

Thermal and turbidity experimentations have been conducted to validate the design of the TAC module.

 

Thermal experimentation

Simulation

Thermal simulations have been done on the software COMSOL. These simulations have been used to verify the heat transfer of the aluminium mold of the modules, thus helping us improving their design. For the TAC, many simulations have been done with different designs. These are the parameters of the simulation for the latest design.

Simulation parameters
Parameters Values
Peltier element cooling power 30W
Peltier element heating power 140W
Air convective heat transfer coefficient 50W/(m2 ℃)
Isolation conductive heat transfer coefficient 5W/(m ℃)
Aluminium type 6061-t6
Aluminium conductive heat transfer coefficient 167W/(m ℃)
Aluminium specific heat capacity 0.896J/(g ℃)
See Results
Back to TAC

Trials protocols

These are the protocol used to test the thermal characteristic of the TAC prototype. These protocols have been tested on a single sub-module of a TAC .


TAC Thermal Experimentations Setup

 

Thermal Experimentations Protocols

 
Maintaining a temperature below room temperature test
Purpose

Determine if the module temperature stability fits the specified of ±1.5℃, when the set temperature is below room temperature. Also, this test determines the voltage versus the set temperature relation.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier gnd and PS gnd to Peltier vcc)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
  5. Wait for the thermometer measure to stabilize for 20 seconds
Measurement
  1. Set the voltage of the high current power supply to 1V
  2. Wait for thermometer measure to stabilize for at least 20 seconds
  3. Note the thermometer measure and the voltage associated with it
  4. Repeats set 1, 2 and 3 and increased the voltage by 1V each time until the thermometer measure is below the specified lower limit (0℃)
  5. Stop the high current power supply
  6. Stop the fan power supply

See Results
Back to TAC Thermal Experimentations Protocols  
Maintaining a temperature over room temperature test
Purpose

Determine if the module temperature stability fits the specification of ±1.5℃, when the set temperature is over room temperature. Also, this test determines the voltage versus the set temperature relation.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier vcc and PS gnd to Peltier gnd)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
  5. Wait for the thermometer measure to stabilize for 20 seconds
Measurement
  1. Set the voltage of the high current power supply to 1V
  2. Wait for thermometer measure to stabilize for at least 20 seconds
  3. Note the thermometer measure and the voltage associated with it
  4. Repeats set 1, 2 and 3 and increased the voltage by 1V each time until the thermometer measure is over the specified upper limit (37℃)
  5. Stop the high current power supply
  6. Stop the fan power supply

See Results
Back to TAC Thermal Experimentations Protocols  
Cooling speed test
Purpose

Determine if the module cooling speed fit the specification of 0.3℃/s above room temperature and 0.2℃/s under room temperature. Also, this test determines the optimal voltage to apply to cool the aluminium mold.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier vcc and PS gnd to Peltier gnd)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
Measurement
  1. Set the voltage of the high current power supply to reach 42℃
  2. Wait for thermometer measure to stabilize for at least 20 seconds
  3. Stop the high current power supply
  4. Invert connection between the Peltier element and the high current power supply
  5. Set the high current power supply to 15.5V (calculated by this method)
  6. Start the chronometer when the thermometer measure reach 37℃
  7. For each 2℃ temperature drop, note the timestamp until 0℃ is reached
  8. Stop the high current power supply
  9. Invert connection between the Peltier element and the high current power supply
  10. Repeats step 1 to 9 for cooling voltage of 15V and 16V

See Results
Back to TAC Thermal Experimentations Protocols  
Heating speed test
Purpose

Determine if the module heating speed fits the specified 0.5 to 1℃/s.

Material Setup
  1. Connect the power supply (Topward 6303D) to the fan
  2. Power up the power supply and adjust the voltage to 12V
  3. Connect the high current power supply (bk precision 1694 power supply) to the Peltier element (PS vcc to Peltier gnd and PS gnd to Peltier vcc)
  4. Set the thermocouple probe at the bottom of the middle hole of the aluminium mold
Measurement
  1. Set the voltage of the high current power supply to reach -5℃
  2. Wait for thermometer measure to stabilize for at least 20 seconds
  3. Stop the high current power supply
  4. Invert connection between the Peltier element and the high current power supply
  5. Set the high current power supply to 24V (Maximal voltage available for the Peltier element)
  6. Start the chronometer when the thermometer measure reach 0℃
  7. For each 5℃ temperature rise, note the timestamp until 37℃ is reached
  8. Stop the high current power supply

See Results
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Turbidity experimentations

One of the main features of the TAC is the ability to measure the optical density of the liquid inside the test tube. This measure could be used to calculate the population of microorganism in the liquid. This experiment was conducted to calibrate the optical density measurement.

Protocol
Purpose

Calibrate the optical density measurement in the TAC.

Material
  • TAC sub-module
  • Reference test tube filled with liquid with different known optical density
Setup
  1. Power up the TAC module
  2. Start the turbidity function (only amplitude difference is shown on screen)
Measurement
  1. Place a reference test tube in the TAC's aluminium mold
  2. Note the amplitude difference output
  3. Repeat step 1 and 2 with a different test tube

See Results
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MC96

A thermal experimentation has been the only experimentation done on the MC96 module.

 

Thermal experimentations

The only experimentations done are simulations because no prototype has been built yet.

Simulation

Thermal simulations have been done on the software COMSOL. These simulations have been used to verify the heat transfer of the aluminium mold of the modules, thus helping us improve their design. For the MC96, some simulation has been done on early design, but none on the final design, due to the complexity of simulating heat pipes.

Simulation parameters
Parameters Values
Peltier element cooling power 4X30W
Peltier element heating power 4X140W
Air convective heat transfer coefficient 50W/(m2 ℃)
Isolation conductive heat transfer coefficient 5W/(m ℃)
Aluminium type 6061-t6
Aluminium conductive heat transfer coefficient 167W/(m ℃)
Aluminium specific heat capacity 0.896J/(g ℃)
See Results
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