Difference between revisions of "Team:Czech Republic/Protocols"
(→Preparation of the substrates) |
(→Glass slide) |
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===== Glass slide ===== | ===== Glass slide ===== | ||
| − | * | + | *Rinse the glass slide with acetone, isopropanol, and deionized water |
| + | *Dry the glass slide with air gun | ||
| + | *Dehydrate the glass slide on a hot plate at 120°C for 30 minutes | ||
| − | PDMS | + | ===== PDMS ===== |
| − | * | + | *Slice the PDMS to individual PDMS replicas |
| + | *Drill holes for microfluidic inlets and outlets | ||
| + | *Clean the PDMS using a scotch tape | ||
=== Air plasma treatment === | === Air plasma treatment === | ||
Revision as of 14:44, 14 September 2015
Protocols
Contents
Purification
....
Restriction
...
GA
...
Soft lithography - PDMS molding
- Silicon masters
- 40g PDMS + 4g curing agent
- curing 80°C/2h
Soft lithography - Bonding PDMS-Glass
Preparation of the substrates
Glass slide
- Rinse the glass slide with acetone, isopropanol, and deionized water
- Dry the glass slide with air gun
- Dehydrate the glass slide on a hot plate at 120°C for 30 minutes
PDMS
- Slice the PDMS to individual PDMS replicas
- Drill holes for microfluidic inlets and outlets
- Clean the PDMS using a scotch tape
Air plasma treatment
- Position the substrate
Permanent irreversible bonding
- Place PDMS over glass slide
- post-bake 80°C/1h
...