Difference between revisions of "Team:Czech Republic/Protocols"
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*Stop the plasma and open the valve to stabilize the pressure, continue immediately with the bonding phase | *Stop the plasma and open the valve to stabilize the pressure, continue immediately with the bonding phase | ||
| − | === Permanent irreversible bonding === | + | ==== Permanent irreversible bonding ==== |
*Place the PDMS replica on the glass slide | *Place the PDMS replica on the glass slide | ||
Revision as of 14:56, 14 September 2015
Protocols
Contents
Purification
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Restriction
...
GA
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Soft lithography - PDMS molding
- Silicon masters
- 40g PDMS + 4g curing agent
- curing 80°C/2h
Soft lithography - Bonding PDMS-Glass
Preparation of the substrates
Glass slide
- Rinse the glass slide with acetone, isopropanol, and deionized water
- Dry the glass slide with air gun
- Dehydrate the glass slide on a hot plate at 120°C for 30 minutes
PDMS
- Slice the PDMS to individual PDMS replicas
- Drill holes for microfluidic inlets and outlets
- Clean the PDMS using a scotch tape
Air plasma treatment
- Place the glass slide and the PDMS replicas into a plasma cleaner, contact surfaces facing upwards
- Exhaust the atmosphere with a vacuum pump and wait until the pressure drops to 500 mTorr
- Activate the plasma for 2.5 minutes at Hi power
- Stop the plasma and open the valve to stabilize the pressure, continue immediately with the bonding phase
Permanent irreversible bonding
- Place the PDMS replica on the glass slide
- Place the bonded device in an oven at 80°C for 60 minutes.
- Seal the inlets and outlets with a scotch tape until use
...