Difference between revisions of "Team:Czech Republic/Protocols"
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| + | = Soft lithography - PDMS molding = | ||
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| + | *Silicon masters | ||
| + | *40g PDMS + 4g curing agent | ||
| + | *curing 80°C/2h | ||
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| + | = Soft lithography - Bonding PDMS-Glass = | ||
| + | |||
| + | *2.5 minutes air plasma treatment | ||
| + | *post-bake 80°C/1h | ||
= ... = | = ... = | ||
{{:Team:Czech_Republic/Template:Bottom}} | {{:Team:Czech_Republic/Template:Bottom}} | ||
Revision as of 19:35, 10 September 2015
Protocols
Contents
Purification
....
Restriction
...
GA
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Soft lithography - PDMS molding
- Silicon masters
- 40g PDMS + 4g curing agent
- curing 80°C/2h
Soft lithography - Bonding PDMS-Glass
- 2.5 minutes air plasma treatment
- post-bake 80°C/1h
...