Difference between revisions of "Team:Czech Republic/Protocols"
(→Soft lithography - Bonding PDMS-Glass) |
(→Preparation of the substrates) |
||
Line 23: | Line 23: | ||
==== Preparation of the substrates ==== | ==== Preparation of the substrates ==== | ||
− | Glass slide | + | ===== Glass slide ===== |
*2.5 minutes air plasma treatment | *2.5 minutes air plasma treatment |
Revision as of 14:38, 14 September 2015
Protocols
Contents
Purification
....
Restriction
...
GA
...
Soft lithography - PDMS molding
- Silicon masters
- 40g PDMS + 4g curing agent
- curing 80°C/2h
Soft lithography - Bonding PDMS-Glass
Preparation of the substrates
Glass slide
- 2.5 minutes air plasma treatment
PDMS
- Cut the PDMS
Air plasma treatment
- Position the substrate
Permanent irreversible bonding
- Place PDMS over glass slide
- post-bake 80°C/1h
...